View DS1249W_1233930.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

09/13/2004
RELIABILITY REPORT FOR
DS1249W
Dallas Semiconductor
4401 South Beltwood Parkway Dallas, TX 75244-3292
Prepared by:
Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com ph: 972-371-3726 fax: 972-371-6016 mbl: 214-435-6610
Conclusion: The following qualification successfully meets the quality and reliability standards required of all Dallas Semiconductor products and processes: DS1249W In addition, Dallas Semiconductor's continuous reliability monitor program ensures that all outgoing product will continue to meet Maxim's quality and reliability standards. The current status of the reliability monitor program can be viewed at http://www.maxim-ic.com/TechSupport /dsreliability.html.* Module Description: A description of this Module can be found in the product data sheet. You can find the product data sheet at http://dbserv.maxim-ic.com/l_datasheet3.cfm.* Reliability Derating: A module device consists of one or more IC's in a single, upward integrated, package. This package is assembled to include batteries, crystals, and other piece parts that make up the configuration of the Module. Because of either the complexity of the package or the included piece parts, standard high temperature reliability testing is not possible. Therefore, in order to determine the reliability of module products, the reliability of each of the piece parts is individually determined, then summed to determine the reliability of the integrated module product. If there are "n" significant components in the module then: Fr (module) = Fr (1) + Fr (2) + Fr (3) + ..... + Fr (n) Fr (module) = Failure rate of module Fr(n) = Failure rate of the nth component Failure Rates are reported in FITs (Failures in Time) or MTTF (Mean Time To Failure). The FIT rate is related to MTTF by: MTTF = 1/Fr NOTE: MTTF is frequently used interchangeably with MTBF. The calculated failure rate for this module/assembly is: Module Device: 1 MEG SRAM 5V BR1632 DS1323 Totals: The parameters used to calculate the module failure rate are as follows: Cf: 60% Tu: 25
C
Module Units: 2 1 1
Quantity: 1789 100 77
Fails: 0 1 0
Ea: 0.7 1.0 0.7
MTTF (Yrs): 95331 47996 9048 7050
FITs: 1.2 2.4 12.6 16.2
The reliability data follows. A the start of this data is the module assembly information. This is a description of the module. The next section is the detailed reliability data for each stress found in the qualification / monitor. If there are additional processes or assemblies used as part of this report, a description of each will follow which includes the respective reliability data for that process/ assembly. The reliability data section includes the latest data available. Some of this data may be generic with other packages or products. * Some proprietary products may be excepted from this requirement. Assembly Information: Assembly Site: Pin Count: Package Type: Body Size: Mold Compound: Lead Frame: Lead Finsh: Die Attach: Bond Wire / Size: Flammability: Moisture Sensitivity (JEDEC J-STD20A) Date Code Range:
PACKAGE TESTS
DESCRIPTION SOLDERABILITY DATE CD CONDITION 0104 MIL-STD-883-2003 MIL-STD-883-2016 JESD22-B102 JESD22-B100 JESD22-B102 JESD22-B100 JESD22-B102 JESD22-B100 READPOINT 5 5 5 5 5 5 5 5 DYS DYS DYS DYS DYS DYS DYS DYS Total: QTY FAILS 3 6 3 6 3 6 3 6 0 0 0 0 0 0 0 0 0 FA#
Fastech 28 Module w/Hi Density SMT 720 Amicon PCB; FR4 ? / UL 94-V0
0104
to 0404
PHYSICAL DIMENSIONS 0104 SOLDERABILITY 0317
PHYSICAL DIMENSIONS 0317 SOLDERABILITY 0333
PHYSICAL DIMENSIONS 0333 SOLDERABILITY 0404
PHYSICAL DIMENSIONS 0404
STORAGE LIFE
DESCRIPTION STORAGE LIFE STORAGE LIFE STORAGE LIFE STORAGE LIFE DATE CD CONDITION 0104 0317 0333 0404 70 C 70 C 70 C 70 C READPOINT 1000 HRS 1000 HRS 1000 HRS 1000 HRS Total: QTY FAILS 77 77 77 77 0 0 0 0 0 FA#
TEMPERATURE CYCLE
DESCRIPTION TEMP CYCLE DATE CD CONDITION 0104 0C TO 70C READPOINT 1000 CYS QTY FAILS 77 0 FA#
TEMP CYCLE TEMP CYCLE TEMP CYCLE
0317 0333 0404
0C TO 70C 0C TO 70C 0C TO 70C
1000 CYS 1000 CYS 1000 CYS Total:
77 77 77
0 0 0 0
UNBIASED MOISTURE RESISTANCE
DESCRIPTION MOISTURE SOAK MOISTURE SOAK MOISTURE SOAK DATE CD CONDITION 0317 0333 0404 60C/90% R.H. 60C/90% R.H. 60C/90% R.H. READPOINT 1000 HRS 1000 HRS 1000 HRS Total: QTY FAILS 77 77 77 0 0 1 1 MODULE TRIM FA#
Assembly Information: Assembly Site: Pin Count: Package Type: Body Size: Mold Compound: Lead Frame: Lead Finsh: Die Attach: Bond Wire / Size: Flammability: Moisture Sensitivity (JEDEC J-STD20A) Date Code Range:
DESCRIPTION ESD SENSITIVITY ESD SENSITIVITY ESD SENSITIVITY LATCH-UP LATCH-UP
Fastech 32 Module w/Hi Density SMT 720 Amicon PCB; FR4 ? / UL 94-V0
0101
to 0422
READPOINT 2 2 3 2 2 PUL'S PUL'S PUL'S DYS DYS Total: QTY FAILS 3 3 3 3 3 0 0 0 0 0 0 FA#
ELECTRICAL CHARACTERIZATION
DATE CD CONDITION 0139 0139 0139 0139 0139 EOS/ESD S5.1 HBM 500 VOLTS EOS/ESD S5.1 HBM 1000 VOLTS EOS/ESD S5.1 HBM 2000 VOLTS JESD78, I-TEST 125C JESD78, Vsupply TEST 125C
PACKAGE TESTS
DESCRIPTION SOLDERABILITY SOLDERABILITY SOLDERABILITY DATE CD CONDITION 0422 0422 0422 JESD22-B102 JESD22-B102 JESD22-B102 READPOINT 1 1 1 DYS DYS DYS Total: QTY FAILS 3 3 3 0 0 0 0 FA#
STORAGE LIFE
DESCRIPTION DATE CD CONDITION READPOINT QTY FAILS FA#
STORAGE LIFE
0139
85 C
1000 HRS Total:
49
0 0
TEMPERATURE CYCLE
DESCRIPTION TEMP CYCLE DATE CD CONDITION 0139 -40 TO 85C READPOINT 1000 CYS Total: QTY FAILS 50 0 0 FA#
TEMPERATURE HUMIDITY BIAS
DESCRIPTION BIASED MOISTURE BIASED MOISTURE BIASED MOISTURE DATE CD CONDITION 0422 0422 0422 85/85, 5.5 VOLTS 85/85, 5.5 VOLTS 85/85, 5.5 VOLTS READPOINT 1000 HRS 1000 HRS 500 HRS Total: QTY FAILS 77 77 77 0 0 0 0 FA#
UNBIASED MOISTURE RESISTANCE
DESCRIPTION MOISTURE SOAK MOISTURE SOAK MOISTURE SOAK MOISTURE SOAK MOISTURE SOAK DATE CD CONDITION 0101 0139 0422 0422 0422 60C/90% R.H. 60C/90% R.H. 60C/90% R.H. 60C/90% R.H. 60C/90% R.H. READPOINT 576 960 HRS HRS QTY FAILS 56 50 77 77 77 0 0 0 0 0 0 FA#
1000 HRS 1000 HRS 1000 HRS Total:
Assembly Information: Assembly Site: Pin Count: Package Type: Body Size: Mold Compound: Lead Frame: Lead Finsh: Die Attach: Bond Wire / Size: Flammability: Moisture Sensitivity (JEDEC J-STD20A) Date Code Range:
DESCRIPTION ESD SENSITIVITY ESD SENSITIVITY ESD SENSITIVITY LATCH-UP LATCH-UP
Fastech 36 Module w/Hi Density SMT 720 Amicon PCB; FR4 ? / UL 94-V0
0139
to 0139
READPOINT 2 2 2 2 2 PUL'S PUL'S PUL'S DYS DYS QTY FAILS 3 3 3 3 3 0 0 0 0 0 FA#
ELECTRICAL CHARACTERIZATION
DATE CD CONDITION 0139 0139 0139 0139 0139 EOS/ESD S5.1 HBM 500 VOLTS EOS/ESD S5.1 HBM 1000 VOLTS EOS/ESD S5.1 HBM 2000 VOLTS JESD78, I-TEST 125C JESD78, Vsupply TEST 125C
Total:
0
STORAGE LIFE
DESCRIPTION STORAGE LIFE DATE CD CONDITION 0139 85 C READPOINT 1000 HRS Total: QTY FAILS 77 0 0 FA#
TEMPERATURE CYCLE
DESCRIPTION TEMP CYCLE DATE CD CONDITION 0139 -40 TO 85C READPOINT 1000 CYS Total: QTY FAILS 76 0 0 FA#
UNBIASED MOISTURE RESISTANCE
DESCRIPTION MOISTURE SOAK DATE CD CONDITION 0139 60C/90% R.H. READPOINT 960 HRS Total: QTY FAILS 76 0 0 FA#

▲Up To Search▲

Price & Availability of DS1249W

	To Download DS1249W Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .